Issachar Conference Group

Polyamide-imide (PAI) resin is a high-performance engineering thermoplastic known for its exceptional thermal stability, mechanical strength, and chemical resistance. It combines structural features of both polyamides (nylons) and polyimides, making it suitable for extreme operating conditions.

It is commonly used in aerospace, automotive, electronics, and industrial applications where conventional plastics fail.

Chemical nature

• Belongs to aromatic high-performance polymers

• Contains both:

  • Amide (–CONH–) groups

  • Imide (–CO–NH–CO–) groups